On the lithography floor, photoresist doesn’t forgive drift. A 2°C shift in the soft bake or hard bake profile and your critical dimension control goes sideways—then the line stops. We built the stainless steel heater housing for wafer fabs where thermal stability isn’t a “nice to have.” It’s the process. What matters under the hood The housing runs a high-purity, electropolished stainless exterior with an internal heater layout tuned for wafer-level uniformity—±0.1°C across the bake surface. Integrated NIR sensors and a sealed control path keep setpoint repeatability tight, so every soft bake and hard bake lands in the same place, cycle after cycle. It’s rated for Class 1–100 cleanrooms and engineered to shed particles: smooth seams, minimal outgassing, and a surface that stands up to aggressive wet-clean protocols. Power is matched to fab utilities, and the interfaces plug into standard wafer-handling platforms without forcing a rework. Why it holds up in production In real lots, that thermal discipline means fewer excursions, lower scrap, and critical dimension performance that stays put across runs. Tighter thermal control cuts time-to-temperature, so you trim idle bake time and energy—without beating up the photoresist profile. Reliability is built into every joint and termination, so the tool keeps running 24/7 with fewer surprises. When bake profiles are repeatable, qualification cycles tighten up, and requalification becomes planned work, not a fire drill. A few shop-floor reminders Because the housing is stainless, grounding and bonding have to be verified at install—stray currents and ESD control are not the kind of variables you chase after the fact. And before you sign off, confirm utility compatibility against the exact tool configuration: voltage, amperage, coolant pressure, and exhaust. A mismatch will cap performance, even if the unit bolts in clean. Map the interfaces early.